Pottery and porcelain and metal solder technology: Cermet material develops applied key

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T i (C, n) fund belongs to pottery and porcelain is a kind of grain composite material, it is the new-style cermet that the development on the foundation that belongs to pottery and porcelain in fund of T i C rises. T i (C, n) fund belongs to pottery and porcelain to have tall hardness, wear-resisting, be able to bear or endure oxidation, anti-corrosive wait for a series of good integral performance, taller red rigid and strength are shown in treatment, it is when same rigidity o of C of WC of wearability prep above hard alloy, and the 1/2 that its density has hard alloy only however. Accordingly, t i (C, n) fund belongs to cutting tool of pottery and porcelain to close to be able to replace WC radical successfully in a lot of treatment field hard alloy and be used as tool material extensively, fill WC radical 2 O of hard alloy and A l the blank between material of cutting tool of 3 pottery and porcelain. Cobaltic natural resources of our country metal is relatively meager, and as a kind strategical precious metal, in recent years cobaltic price lasts on raise, accordingly, t i (C, n) the development development that fund belongs to material of cutting tool of pottery and porcelain and wide application, can drive material of our country hard alloy not only upgrade replacement, and the port with raising national natural resources to ensure level field to also be had principal. What we develop is the T i that adds T i N (C, n) fund belongs to pottery and porcelain. Because T i C compares WC to have taller hardness and wearability, the affiliation of T i N can rise to refine the action of grain, reason T i (C, n) fund belongs to pottery and porcelain to be able to be shown compare WC radical or T i C base the integral performance with more superior hard alloy. The join technology that succeeds with its is premise the wide application of material of cutting tool of this kind of new-style cermet, began not little research domestic and internationally to the join of pottery and porcelain and metal, but less to cermet and research of metallic connective technology, as a result at restricting T i (C, n) fund belongs to material of pottery and porcelain to produce medium wide application in industry. Of commonly used join pottery and porcelain and metal solder the method has vacuum electron beam diffusion welding of laser beam welding, vacuum and solder, drill rod solder. In these join methods, method of join of drill rod solder, diffusion welding compares mature, application more extensive, transfer the new join method such as fluid photograph join and craft are studying development is medium. The article is summing up all sorts of pottery and porcelain and metal to solder on methodological foundation, to cermet and metal solder the technology undertakes preliminary discuss, introducing all sorts of applying to cermet and metal solder technics while, point out its actor or actress defect is mixed remain the problem of thrash out, with period drive cermet and metal to solder technical research, popularize the application of material of this kind of advanced tool in industrial domain then. T i (C, n) fund belongs to characteristic of function of pottery and porcelain and i of T of applied current situation (C, n) fund belongs to pottery and porcelain is material of pattern of a kind of when in T i the development on C radical cermet foundation rises new-style industry. By its composition and function differ can divide for: The T i that ① composition is o of M of i of N of T i C C radical alloy; ② adds other carbide (wait like C of a of WC, T) with the metal (the o that be like C) C of i of Jiang Ren T base alloy; The N of i of T of T i C that ③ adds T i N (or T i CN) base alloy; The T i that ④ is bases with T i N N radical alloy. T i (C, n) the function characteristic that fund belongs to pottery and porcelain is as follows: (1) tall hardness, can amount to HRA commonly 91 ~ 93.

5, some can amount to HRA 94 ~ 95, reach level of hardness of cutting tool of metalloid pottery and porcelain namely. (2) has very tall wearability and ideal fight crescent moon to wear away depression ability, when steel of high speed cutting expects wear rate is extremely low, its wearability can compare WC radical hard alloy is tall 3 ~ 4 times. (3) has taller fight oxidation ability, crescent moon of general hard alloy wears away depression begin to produce temperature to be 850 ~ 900 ℃ , and T i (C, n) fund belongs to pottery and porcelain to be 1100 ~ 1200 ℃ , tower above 300 ℃ of 200 ~ . 2 have the T i O that oxidation of T i C forms lubricant action, oxidize so degree relatively WC radical alloy is low about 10% . (4) has taller hear resistance, t i (C, n) intensity of the high temperature hardness that fund belongs to pottery and porcelain, high temperature and high temperature wearability are better, in 1100 ~ the Shangneng below 1300 ℃ high temperature undertakes cutting. General cutting speed can compare WC radical hard alloy is tall 2 ~ 3 times, can amount to 200 ~ 400 m / m i n . (5) chemistry has been stabilized, t i (C, n) when fund belongs to cutting of cutting tool of pottery and porcelain, in cutting tool and cut the meeting on interface of bits, workpiece to form 2 O of M o 3, salt of nickel molybdic acid and oxidation titanium film, they can reduce attrition as dry lubricant. T i (C, n) base alloy and steel produce felt not easily, in 700 ~ felt circumstance also did not discover when 900 ℃ , produce the tumor that accumulate bits not easily namely, treatment surface surface roughness is worth inferior. T i (C, n) fund belongs to pottery and porcelain to be in have good integral performance while the material of precious rare metal such as a of the C o with indispensible place of OK still and managing common hard alloy, T, W. Carry out as human resource conservation " green industry " of the process accelerate, t i (C, n) the tool material that fund belongs to pottery and porcelain to will surely become a kind to have an outlook greatly. Current, t i (C, n) fund belongs to material of pottery and porcelain to get world each country especially extensive and thorough research of Japan, a few countries already were applying actively and spread material of this kind of cutting tool, manufacturer of production of each main hard alloy rolled out the world the cermet containing nitrogen of commodity brand. The hardness that if 3 water chestnut of Japanese are integrated,the 2525 brands of NX of data company development exceed fine atomic cermet is achieved 92.

2 HRA, bending strength is amounted to 2.

0 GP a , hold a tall hardness and tall tenacity concurrently. Our country is in " 85 " during the T i that develops an a variety of shop signs successfully also (C, n) fund belongs to cutting tool of pottery and porcelain, and batch appears on the market, already developed the material of a kind of cutting tool that makes independent series now. The technics that cermet and metal solder is in industrial treatment production, cutting machines the join means of the razor blade of cutting tool and arbor to have two kinds: Solder type and machine clip type. The razor blade of cutting tool and arbor connective stand or fall affect the service life of cutting tool directly. Song Liqiu consider to make clear through the experiment: Choose solder when type join razor blade and arbor, cutting tool durability is tall; When choosing machine clip form, cutting tool durability is low. As a result of T i (C, n) fund belongs to pottery and porcelain to belong to brittleness material, melting point is higher than the metal, coefficient of its linear expansion and metal differ bigger, make T i (C, n) the leftover stress in the connect after fund belongs to razor blade of pottery and porcelain and arbor solder is very tall, the consistence of together with and metal is poorer, make the weldability of cermet and metal poorer, solder commonly method and craft gain satisfaction very hard solder contact, current, use drill rod solder and diffusion welding to undertake joining already was acquisitioned succeeding to cermet and metal. As the ceaseless development of research, appeared again a lot of new methods and craft, introducing all sorts of applying to below cermet and metal solder technics while, point out its actor defect and research direction. 1 fused solder fuses solder is application is the widest solder method, this method uses constant heat source, make join place local and fused into the liquid, cool again next crystallization becomes an organic whole. Solder heat source has electric arc, laser bundle wait with electron beam. At present T i (C, n) fund belongs to pottery and porcelain to fuse solder basically exists the following two problems remain to solve: It is as fused temperature elevatory, fluidity is reduced, promote likely matrix and increase chemistry reacts between the photograph (the interface reacts) happen, reduced solder the intensity of contact; Another problem is the cermet that lacks special development stuff of fused solder stuff. Arc welding of 1) arc welding is to fuse one the most extensive kind applies to solder at present in solder method. Its advantage is application agile, convenient, applicability is strong, and equipment is simple. But when this method undertakes soldering to pottery and porcelain and metal cause extremely easily matrix and heighten the chemical response between the photograph (interfacial reaction) . As a result of T i (C, n) fund belongs to pottery and porcelain to have conductivity, can solder directly, to T i (C, n) it is feasible that fund belongs to the experiment of pottery and porcelain and metallic arc welding to consider to make clear, but need solves reaction of such as interface, weld defects (crackle) and solder contact intensity is low problem. Laser beam welding of 2) laser beam welding is special it is important to reach a kind when difficult solder material solders solder method. Because stimulate the energy density of beam of light big, because this laser beam welding has frit deep big, frit is wide small, solder the small, leftover stress after reducing weldment to solder mixes hot influence area be out of shape small characteristic, can make the stable join contact below high temperature, can be opposite of the product solder quality undertakes be controllinged accurately. Laser beam welding receives a technology to apply already successfully at the pulverous metallurgy material of the agglomeration in vacuum. According to the report, center of application of laser of a of d of i of e of w of t of M i t developed a kind of double laser bundle solder method. It works with two bundles of laser, a bundle of laser assumes the warm-up of workpiece, another bundle of laser is used at soldering. With this kind of double laser bundle solder the join that the method can implement all sorts of geometry system, and won't reduce the intensity of raw material and high temperature capability, weld time needs several minutes only. This method can prevent effectively to solder the generation that influence area crackle heats up in the process, apply to T i (C, n) fund belongs to pottery and porcelain and metal solder, but taller to requirement of work of the tool clamping apparatus, preparation before cooperating precision and solder, installation cost is high, moving cost is higher, need raises its craft repeatability and dependability further. Electron beam of 3) electron beam solder solder is weldment of a kind of electron beam bombard that uses high-energy density makes its local heating is mixed fuse and solder the method that rise. Vacuum electron beam solder is cermet solders effectively with what the metal solders method, it has a lot of advantages, because be to be below vacuum condition, the pollution that can prevent the oxygen in air, nitrogen to wait; Focusing of electron beam classics can form very petty diameter, but small to Φ 0.

1 ~ 1.

The limits of 0 m m , its power density can raise 107 ~ 109 W / c m 2. Because solder has this electron beam,heat area frit of small, welding line is wide small, frit is deep big, solder hot influence area is small wait for an advantage. But the defect of this kind of method is equipment complex, to soldering craft asks more severe, manufacturing cost is higher. Be aimed at T i at present (C, n) the electron beam that fund belongs to pottery and porcelain and metal solders the technology still is in experimental phase. Solder of drill rod of solder of 2 drill rod is heat material to proper temperature, one kind when at the same time applied drill rod expects and make material produces tie solders method. Method of drill rod solder presses heat source normally or heat the method will classify. The method of drill rod solder that has industrial application value at present has: (1) flame brazing; (Solder of the drill rod in 2) furnace; (Solder of 3) induction drill rod; (Solder of 4) resistor drill rod; (Solder of 5) macerate drill rod; (Solder of 6) infrared drill rod. Drill rod solder is T i (C, n) fund belongs to pottery and porcelain and metallic connective to basically solder one kind method, the quality of connect of drill rod solder basically depends on choose right drill rod stuff and technology of drill rod solder. Pair of T i such as Li Xianfen (C, n) fund belongs to pottery and porcelain and 45 steel to used makings of drill rod of cupreous radical, silver radical to undertake flame brazing experiment is mixed respectively in argon gas protects solder of the drill rod in furnace to experiment. Below flame brazing condition, with H the average shear strength of the connect of the 62 makings that it is drill rod is 37 MP a , the shear strength of the connect that with BA g n of Z of 10 C u expects for drill rod amounts to 114 MP a , the average shear strength of the connect that is drill rod makings with n of M of n of BC u Z 49 MP a ; In argon condition of solder of gas protection furnace falls, with H the average shear strength of the connect of the 62 makings that it is drill rod is 37 MP a , with A g the average shear strength of the connect of the 28 makings that it is drill rod is 72 C u 51 MP a . Through the union of observation and connect of solder of analytic drill rod the circumstance reachs shear test, make clear T i (C, n) fund belongs to pottery and porcelain to have sex of better drill rod solder. But leftover stress exists in be in cermet as a result of contact interface, when bringing about shear test, all break go up in cermet, and the shear strength of connect of drill rod solder is not high. Zhang Lixia used makings of drill rod of n of Z of u of A g C to realize fund of T i C to belong to pottery and porcelain and join of cast-iron drill rod solder. Still used development of the technology that be not brilliant to succeed to contain titanium alloy department newly in recent years, be like alloy of i of T of i of C u T, N i , can use pottery and porcelain of drill rod solder and metal directly, the working temperature of its connect compares those who use solder of drill rod of makings of silver-colored copper drill steel to want to be gotten high much. Current, the leftover stress in solder need solves cermet drill rod how to be reduced or eliminating an interface to be in cermet and the question that raise contact intensity. The 3 base metal when pressing solder to press solder do not fuse normally, solder temperature the melting point under the metal, some also heats to fused condition, still be united in wedlock in order to originally and form joint, can reduce the high temperature ill effect to mother capable person so, raise cermet and metal solder quality. Diffusion welding of 1) diffusion welding is a kind when press solder, it is to point to the surface in mutual contact, below the action of high temperature pressure, be joined the surface is stood by each other, local happening plasticity is out of shape, the reliable join process that diffuse each other between atom and fashions whole via the layer is united in wedlock after proper time. Diffusion welding includes to do not have the diffusion welding of intermediate layer and the diffusion welding that have intermediate layer, the diffusion welding that has intermediate layer is the method that uses generally. Use intermediate layer alloy to be able to be reduced solder temperature and pressure, reduce solder the total stress level in contact, improve the intensity performance of contact thereby. Additional, to reduce contact stress, except use multilayer outside intermediate layer, among the compensation that still can use low modulus layer, this kind of intermediate layer is by fiber metal place is comprised, it is the fiber metal spacer of an agglomeration actually, porosity is highest can amount to 90% , can reduce the stress of the generation when metal and pottery and porcelain solder effectively. The main good point of diffusion welding is join intensity tall, dimension is controlled easily, agree with join is heterogeneous material. Pair of cermet edge such as Guan Dehui and the diffusion welding of high temperature vacuum of 40 C r cutter hub receive an experiment to make clear, after cermet and 40 C r solder, seam of two kinds of material is quite good, undertake moving pledging handling to 40 C r again, the interface has quite high strength, the tensile strength of solder abutment face amounts to 650 MP a , shear strength achieves 550 MP a . The inadequacy with main diffusion welding is to diffuse tall, time grows temperature and join, facility leaves in vacuum costly, cost is high. In recent years ceaseless development went a few new diffusion welding to accept a method, be like the diffusion welding below high-pressured electric field, this method have the aid of at high-pressured electric field (1000 V above) the joint action that reachs temperature, make ionization of the dielectric inside pottery and porcelain, one layer was formed to be full of the polarization area of anion inside material of as adjacent as the metal pottery and porcelain. In addition, as a result of material surface microscopical and rough degree, only individual bit photograph is contacted between pottery and porcelain and metal, major area forms the clearance of micron class. Build up in little space the ion of two side makes the electric field of these areas lifts quickly, this is adscititious electric field can increase 3 ~ 4 amounts class. Because photograph of opposite sex charge is sucked, make by connective interface of adjacent of phase of two kinds of data achieves close together contact (its span is less than atomic span) , subsequently have the aid of at diffusing action, make metal and pottery and porcelain are able to join. Friction welding of 2) friction welding is to be below axial pressure and torque action, use solder the opposite motion between osculatory end panel and the attrition heat that plasticity flow place produces and plasticity are out of shape hot, make interface reachs his close area achieves voice of character sticking model to produce proper macroscopical plasticity to be out of shape, next rapid upset and finish a kind of when solder method that press solder. Friction welding is used extensively at congener the join with heterogeneous metal, still belong to to pottery and porcelain of not congener material and metallic connective friction welding start level. Ultrasonic of 3) ultrasonic solder solder is a kind of when realize the metal below normal temperature and joint of pottery and porcelain through ultrasonic vibration and pressurization effective method. Solder with this method aluminium and of all kinds pottery and porcelain all score a success, and joint time needs a few seconds only. Because the joint of this method can be to use ultrasonic vibration, combinative scale does not need to undertake finishing, equipment is simpler, shortened weld time, its cost is reduced substantially than law of drill rod solder. This method applies at cermet and metal solder to still remain at further research. 4 neutral are atomic bundle of illuminate law neutral is atomic Farley uses bundle of irradiation neuter is atomic the joint face of bundle of illuminate metal and pottery and porcelain, make the atom of joint face " activation " . The surface of corporeal cleanness has admirable active, corporeal appearance often is stained with contamination or covering a paper-thin oxidation film however, make its active is reduced. The 1000 ~ that this method basically is the inert gase such as argon of pair of joint face illuminate the feebleminded atom of 1800 e V bundle, the layer that from exterior eliminate 20 n m controls, make exterior activation, next pressurization, use the reaction with exceedingly good surface to spend undertake normal temperature condition issues joint, this method can be used at nitrogen to change the joint of the high strenth pottery and porcelain such as silicon and metal. 5 spread oneself high temperature synthesis solders the law spreads oneself high temperature is synthesized (s of i of s of e of h of t of n of y of S of e of r of u of t of a of r of e of p of m of e of t of h of g of i of H of g of n of i of t of a of g of a of p of o of r of p of f of S e l , abbreviate SHS) the technology also calls combustion to synthesize (s of i of s of e of h of t of n of y of S of n of o of i of t of s of u of b of C o m , abbreviate CS) technology, be by make difficult frit compound (carbide, nitride and silicon change thing) the means develops and come. In this kind of method, place the solid powder that can burn and gives off a large number of generating to heat up between pottery and porcelain and metal above all, use electric arc next or radiation general powder is local ignite and begin reaction, the quantity of heat that emits by reaction place drives reaction initiatively to continue to develop ahead, the product that makes finally by reaction place joins pottery and porcelain and metal firmly together. The marked characteristic of this method is specific power consumption low, manufacturing efficiency is tall, small to the hot effect effect of mother capable person, the welding line that changes through designing composition gradient will join heterogeneous material, can overcome what cause as a result of difference of hot coefficient of expansion to solder leftover stress. But gas phase reaction and harmful impurity may arise when combustion invade, make contact produces air hole and contact intensity to reduce thereby. Accordingly, join had better undertake in protecting atmosphere, right the two upright pressurization of pottery and porcelain and metal. o of t of o of m of a of M i y use SHS to solder first technology, studied metallic M o and T i B 2 with pottery and porcelain of T i C solder, the experiment uses T i + B or T i + C powder regards reaction as raw material, after be being pressed into base beforehand, add in two M o piece between, use black lead to cover electrify to give out heat will cause reaction, obtained an interface successfully to be united in wedlock to solder thoroughly contact. He Daihua use combustion to synthesize a technology to be made successfully took T i B 2 pottery and porcelain / sample of metallic F e , and band of solder abutment cover is good, the quality of e of F of intermediate solder layer when 100 minutes of content are higher, the interface with 100 minutes of low content combines quality of e of F of interfacial union excel circumstance. Sun Dechao with FGM solder (functional gradient material) realized pottery and porcelain of S i C and GH successfully the SHS of 4146 alloy solders. At present SHS mechanism considers to have not mature, equipment development and applied investment are quite large, so SHS solders have not the project is changed. 6 fluid photograph transfers solder law fluid photograph transfers solder (e of s of a of h of P of d of i of u of q of i of L of t of n of e of i of s of n of T r a , abbreviate TLP) it is to upright to be mixed at dissolve solder pressure between solder solder method. This technology is integrated technology of drill rod solder and diffuse the advantage of join technology, but preparation enlists in army temperature not the high temperature connect under join temperature. TLP joins craft TLP of the technology solders to operate measure likeness with drill rod solder, all need to be in need join mother capable person melting point is put between the surface the 3rd kind of material under mother capable person (n of intermediate layer I calls t e in TLP middling r of e of y of r l a , drill rod calls) of l of a of t of e of m of r of e of l of l of makings F i in middling of drill rod solder; Heat next, heat preservation. But both the diffusing sufficient level, discontinuous level of the composition of caky means and final income connect, organization is different. Solder than TLP with photograph of drill rod solder have following advantages: ① TLP connect is in isothermal and caky the part that is different from mother capable person and fill metal apparently is had after finishing, do not give the fill metal in final microstructure in the resolution below particular case; ② TLP connect is compared general the intensity of connect of solder of hard drill steel is high; The connect of solder of drill rod of remelting temperature prep above of ③ TLP connect and high temperature resistant performance is good. Afore-mentioned advantages decided it can be used at the join of advanced material, solder in cermet and metal there is wide applied perspective in the technology. Duanhui equality uses u of T i C and i of T i N compound solder, use preparation of ground of success of TLP join technology the l of T i A that does not have weld defects / 718 alloy of IN contact. T i (C, n) fund belongs to pottery and porcelain is stuff of a kind of cutting tool of high speed cutting that has an outlook most, of it and metal soldering is T i (C, n) one of crucial technologies that fund belongs to pottery and porcelain to material is able to develop and apply. The crucial question that solders between cermet and metal is solution of interfacial embellish wet gentle solders leftover stress, the exterior state that can carry choice active element and cermet to produce interfacial reaction to change pottery and porcelain commonly rises thereby both the wetability between, one of development direction that because the leftover thermal stress that coefficient of expansion does not match and arises is heated up between mother capable person,alleviate are to pass SHS to synthesize functional gradient material (FGM) as solder, can alleviate greatly thereby the leftover thermal stress that contact solders between cermet and metal. The place on put together is narrated, although agree with T i (C, n) the method that fund belongs to pottery and porcelain and metal to solder has a variety of, but the actor drawback that every kinds of method has its oneself and limitation, if use the contact interface that diffusion welding solders to suffer,be restricted and be in easily contact forms harmful and compound carbide (η photograph) ; Strength of union of existence of drill rod solder and use temperature is lower problem; Craze of brittleness of fusion welding easy generation and lack solders suitably material. Some methods still are in an experiment to study level, return temporarily hard practical change. Solder in the choice when the method, should from set out actually, namely from cermet and metal the use requirement of complex component part sets out, assure join quality and its stability really, and do one's best reduces manufacturing cost. Integrated consideration solders the element that reachs the side such as craft, join of photograph of fluid of instant of solder of active drill rod, diffusion welding, part, SHS solders the technology is the most hopeful become cermet and metal to solder the research project that develops mainly in craft. Of cermet and metal soldering is a brand-new domain, content is novel and unusually rich, will expand of the wide application as this kinds of material and applied limits ceaselessly henceforth, the research task that its solder to the research of technics and craft will become domestic and international widespread attention and be solved urgently. CNC Milling CNC Machining